Product Capability1. PCB/PCBA ODM & OEM Service2.THREE SMT LInes, TWO DIP LINES and TWO Assembly Lines.3. Five Engineers4. ISO9001,RoHs,CEPCB CapabilityLayer count1-18 layersMaterialfr4,Tg=135,150
1. PCB/PCBA ODM & OEM Service
2.THREE SMT LInes, TWO DIP LINES and TWO Assembly Lines.
3. Five Engineers
4. ISO9001,RoHs,CE
PCB Capability | |
Layer count | 1-18 layers |
Material | fr4,Tg=135,150,170,180,210,cem-3,cem-1,al base,teflon,rogers,nelco |
Copper thickness | 1/2oz,1oz,2oz,3oz,4oz,5oz |
Board thickness | 8-236mil(0.2-6.0mm) |
Min.line width/space | 3/3 mil(75/75um) |
Min. drill size | 8 mil(0.2mm) |
Min. HDI laser drill size | 3 mil(0.067mm) |
Tolerance of hole size | 2 mil(0.05mm) |
PTH copper thickness | 1 mil(25 um) |
Solder mask color | Green,blue,yellow,white,black,red |
Peelable solder mask | Yes |
surface treating | HASL(ROHS), ENING,OSP,IMMERSION SILVER,IMMERSION TIN,flash gold |
Gold thickness | 2-30u" (0.05-0.76um) |
Blind hole/buried hole | Yes |
V-cut | Yes |
PCBA Capability | |
Technology | SMT, THT |
SMT capability | 2,000,000 points per day |
DIP capability | 300,000 points per day |
Experiences | QFP, BGA, μBGA, CBGA |
Process | Lead-free |
Programming | Yes |
Conformal coating | Yes |
