China USB Flash drive PCB assembly USB PCBA
PCBA/PCB Assembly Specification
PCB Layers | 1 Layers to 12 layer (standard), |
PCB material/type | FR4, Aluminum, CEM1, Supper-thin PCB, FPC/Gold finger |
Assembly service type | DIP/SMT or Mixed SMT & DIP |
Copper thickness | 0.5 OZ-5 OZ |
Assembly surface finish | HASL, HASL Lead Free, ENIG, OSP |
PCB Dimension | 600x1200mm |
IC Pitch(min) | 0.2mm |
Chip Size(min) | 0201 |
Leg distance(min) | 0.3mm |
BGA Size | 8x6mm~55x55mm |
SMT Efficiency | SOP/CSP/SSOP/PLCC/QFP/QFN/BGA/FBGA/u-BGA |
u-BGA ball dia. | 0.2mm |
Required Docs for PCBA | Gerber file with BOM list & Pick-N-Place File(XYRS) |
SMT speed | CHIP components SMT speed 0.3S/pcs, max speed 0.16S/pcs |
What we can do for you?
EMS-Electronic Manufacturing Service
PCB Supply and Layout
PCB Assembly on SMT, BGA and DIP
Cost Effective Components Sourcing
Fast Turn Prototype and Mass Production
Box Build Assembly
Engineering Support
Tests(X-ray, 3D Paste Thickness, ICT, AOI and Functional tests)
Logistics and After-sales Service
Detailed Terms for PCB Assembly
Technical requirement:
Professional Surface-mounting and Through-hole soldering Technology.
Various sizes like 1206,0805,0603 components SMT technology.
ICT(In Circuit Test),FCT(Functional Circuit Test) technology.
PCB Assembly With UL,CE,FCC,Rohs Approval.
Nitrogen gas reflow soldering technology for SMT.
High Standard SMT&Solder Assembly Line.
High density interconnected board placement technology capacity.
Quote requirement:
Gerber file of the bare PCB board.
BOM (Bill of material) for assembly.
To short the lead time, please kindly advise us if there is any acceptable components substitution.
Testing Guide & Test Fixtures if necessary.
Programming files & Programming tool if necessary.
Schematic if necessary.